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Reducing the Gold Film Residual Stress by Using the Crystalline Piezoelectric Property in Piezoelectric/Au Thin Films
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Abstract
This work proposes a successful and novel method to significantly reduce the residual stresses of a 40 nanometer gold film in piezoelectric/Au thin films to improve the quality and mechanical properties of Au film. The gold film with 40 nm thickness is deposited on piezoelectric by means of diode sputtering system. Sample phases were examined using (XRD) analysis and the film residual stress is measured by the X-ray diffraction method. The numerical value of residual stress, has been obtained as 4.88±4.54 (MPa). Afterward, the 10 (kHz) frequencies with 12 volt amplitude were applied to the piezoelectric as substrate during 20 minutes. Subsequently, the residual stress values, was reduced to 2.68±1.63 (MPa). As a consequence, we were able to reduce the gold film residual stress through a new method, using the crystalline piezoelectric property. To obtain any information about structural changes in the film, X-ray diffraction measurements were performed. At the end of this article, the reasons for stress reduction that is related to the changes in full width-half maximum (FWHM), crystal aggregation, d-spacing and grain sizes factors of thin films has been investigated.
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References
P. Šutta, Internal Stresses in Plastically Deformed gold films Investigated by x-ray Diffraction, Materials Structure, vol. 8, (2001), 68-70.
M. Aguilar, Materials and Manufacturing Processes, Vol. 13 (1998), 445-453.
S. Pandey et al, Biosynthesis of Highly Stable Gold nanoparticles Using Citrus limone, Annals of Biological Research, 3 (5): (2012), 2378-2382.
M. Aguilar, Electromigration in gold thin films, Thin Solid Films 317(1998)189–192.
A. Proszynski et al, Stress modification in gold metal thin films during thermal annealing, Optica Applicata, Vol. XXXIX, No. 4 (2009), 705-710.
D. Chocyk, Post- deposition stress evolution in Cu and Ag thin films, Optica Applicata, Vol. XXXV, No. 3 (2005), 419-424.
R .O. E. Vijgen et al, Mechanical measurement of the residual stress in thin PVD films, J. Thin Solid Films 270 (1995) 264-269.
G. Hakansson, Growth of Compound and Superlattice Thin Films: Effects of Energetic Particle Bombardment, Ph.D. Thesis, Dept. Physics and Measurement Technology, Linkoping Univ, 1991.
A. A. Griffith, The phenomena of rupture and flow in solids, Phil. (Trans. Roy.Soc. London Series A, 221,PP 163, 1921).
A. A. Volinsky, Fracture patterns in thin films and multilayer's, Mat. Res. Soc. Symp. Proc, 795, U3.8.1, 2004.
M. Ohring, Materials science of thin films. (Academic Press, San Diego 2002).
D. W. Hoffman, Perspective on stresses in magnetron-sputtered thin films , J. Vac. Sci. Technol. A, 12(4) (1994), 953.
R. W. Hoffman, Stresses in shin films, Thin Solid Films, 34(1976), 185.
A. Komijani, emerging paradigms in nanotechnology, (Dorling Kindersley(India) Pvt. Ltd. Licencees of Pearson Education in South Asia 2013, ISBN 978-81-317-8991-9, pp 551-557).
M. Komijani et al, Non-linear thermoelectrical stability analysis of functionally graded piezoelectric material beams, Journal of Intelligent Material Systems and Structures, 24(4) (2013), 399-410.
A. K. Pandey et al, Effect of metal coating and residual stress on the resonant frequency of MEMS resonators, Sadhana Vol. 34, Part 4 (2009), 651–661.
L. H. Van Vlack, Elements of Material, Science and Engineering, fifth edition. (Addison – Wesley Publishing Company, 355, 1987).
A. J. Mohammad , Studying the Effect of Molarity on the Physical and Sensing Properties of Zinc Oxide Thin Films Prepared by Spray Pyrolysis Technique, Ph.D. Thesis , Dept. physic, College of Science, Al-Mustansiriyah Univ, Baghdad, Iraq, 2007.
S. O. Kasor, Principles of Electronic Materials and Devices, second edition (Mc Grow Hill, 2002, chapter 7).
N. G. Ferreira et al, Analysis of residual stress in diamond films by x-ray diffraction and micro-Raman spectroscopy , J. Appl. Phys., Vol. 91, (2002), 2466-2472.
M. C. Salvadori et al, Nanostructures Gold Thin Films: Young Modulus Measurement, J. Surf. Rev. Lett. Vol. 10, (2003), 571-575.
C. A. Neugebauer, Tensile Properties of Thin, Evaporated Gold Films, J. Appl. Phys. 31 (1960), 1096-1101.
A. J. Mohammed et al, Effect of Glucose (C6H12O6) Addition on Piezoelectric Properties for Sensor Application, American Journal of Biomedical Engineering, 2(6), (2012), 287-292.
I. C. Noyan et al, Residual Stress – Measurement by Diffraction and Interpretation. (Materials Research and Engineering, Springer-Verlag, New York Inc, 1987).
B. D. Cullity. Elements of X-ray diffraction, second edition. (Addison Wesley, ISBN 0-201-01174-3, 1977).
M. E. Fitzpatrick et al, Determination of Residual Stresses by X-ray Diffraction, Measurement Good Practice Guide No. 52, ISSN 1744-3911, (2005).
S. Imai et al, A thin-film piezoelectric impact sensor array fabricated on a Si slider for measuring head-disk interaction, IEEE transactions on magnetic, vol. 31, (1995), 3009-3011.
D. V. Leff et al, Syntesis and characterization of hydrophobic, organically-soluble gold nanocrystals functionalized with primary amines, Langmuir, 12 (1996), 4723-4730.
J. A. FLORO et al, The dynamic competition between stress generation and relaxation mechanisms during coalescence of Volmer–Weber thin films , J. Appl. Phys. 89(9), (2001), 4886–4897.
J. A. FLORO et al, Physical origins of intrinsic stresses in Volmer–Weber thin films, (MRS Bulletin 27(1), 2002. pp. 19–25).
A. Zelati, Preparation and Characterization of Barium Carbonate Nanoparticles, International Journal of Computer engineering and Applications, Vol. 2, (2011), 299- 303.
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