Thermo Mechanical Modeling of Piezoresistive Pressure Sensor

Beddiaf Abdelaziz(1*), Fouad Kerrour(2), Salah Kemouche(3)

(1) University Constantine1, Faculty of Engineering Sciences, Electronics’ Department, MoDERNa Laboratory, Algeria
(2) University of Constantine 1, Route d’ Ain El Bey, 25000 Constantine, Algeria
(3) University of Constantine 1, Route d’ Ain El Bey, 25000 Constantine, Algeria
(*) Corresponding author


DOI's assignment:
the author of the article can submit here a request for assignment of a DOI number to this resource!
Cost of the service: euros 10,00 (for a DOI)

Abstract


In this paper we investigate the thermo mechanical behavior of a silicon piezoresistive pressure sensor. The totally built-in thin silicon membrane sensor response computation under constant and uniform pressure assuming small deflections have been determined using Finite Element Analysis (FEA) made in COMSOL. The model solved by COMSOL environment takes into account the entire sensor and thermal effects caused by the manufacturing process of the device. This allows a better understanding and monitoring the thermal drifts that can affect the sensor. COMSOL is easy to implement, ensures a good result in matters of affinity and it allows us to be closer to the real structure of the sensor with extreme flexibility. A temperature study of sensor was performed and the results allow us to predict the sensor behavior against temperature and to minimize this effect by optimizing the doping concentration. Finite Element Analysis (FEA) provides a reliable tool to carry out the required parametric studies in order to optimize the sensor performance.
Copyright © 2014 Praise Worthy Prize - All rights reserved.

Keywords


Deflection; Stress; Piezoresistive Pressure Sensor; Silicon; COMSOL

Full Text:

PDF


References


M. Olszacki et al, A multi-domain piezoresistive pressure sensor design tool based on analytical models, Euro Sim E 2007, Freiburg, Germany, Avril 2008.

S. Timoschenko, J. Gere , Theory of elastic stability McGraw-Hill (New York, 1963).

D. Maier-Schneider A new analytical solution for the load-deflection of square membranes Journal of Microelectromechanical Systems, vol. 4, no. 4, pp. 238-241, 1995.

J.J. Vlassak, W.D. Nix A new bulge test technique for the determination of Young's modulus and Poisson's ratio of thin films Journal of Materials Research, vol. 7, no. 12, pp. 3242-3249.

F. kerrour and al, A new numerical approach for modeling of silicon piezoresistive sensors , Sciences & Technologie B – N°26, 7-12, Décembre 2007.

Y. Naciri, Contribution a l’etude de capteurs de pression capacitifs miniaturises, PhD dissertation, Université Paul Sabatier de Toulouse, 1986.

Ingelin Clausen, Ola Sveen, Die separation and packaging of a surface micromachined piezoresistive pressure sensor, Sensors and Actuators A 133 (2007) 457–466.

Cheng-Chun Leea, Qing Guoa, Effect of electrode size and silicon residue on piezoelectric thin-film membrane actuators, Sensors and Actuators A 147 (2008) 279–285.

Xin Li , Qin Liu, Shixin Pang, Kaixian Xu, Hui Tang, Chensong Suna, High-temperature piezoresistive pressure sensor based on implantation of oxygen into silicon wafer, Sensors and Actuators A 179 (2012) 277– 282.

A. R Mohammadi, C. P J Bennington and M. Chiao, Development of a combined piezoresistive pressure and temperature sensor using a chemical protective coating for Kraft pulp digester process monitoring, J. Micromech. Microeng. 21 (2011) 015009.

H.E. Elgamel, Closed from expressions for the relationship between stress, diafragm deflection, and resistance change with pressure in silicon piezoresistive pressure sensors, Sensors and Actuators A, 50 (1995) 17-22.

Introduction to COMSOL Multiphysics, December 2013 [Online] available at: http: // www.comsol.com/products/tutorials/introduction/

L. Inden, L. Tenerz, J. Tiren and B. Hok, Fabrication of three dimensional silicon structure by means of doping selective etching, Sensors and Actuators 16, p. 67, 1989.

Juric-Grgic, I., Lucic, R., Kurtovic, M., Analysis of grounding electrode dynamic characteristics using FEM, (2008) International Review of Electrical Engineering (IREE), 3 (3), pp. 479-483.

Xlan-ping Wu, Mel-feng Hu, Jla-ymg Shen and Qmg-hua Ma, A miniature piezoresistive catheter pressure sensor, Sensors and Actuators A, 35 (1993) 197-201.

Ingelin Clausen and Ola Sveen , Die separation and packaging of a surface micromachined piezoresistive pressure sensor, Sensors and Actuators A 133 (2007) 457–466.

Dean Deng, Influence of deposition sequence on welding residual stress and deformation in an austenitic stainless steel J-groove welded joint, Materials and Design 49 (2013) 1022–1033.

G. Blasquez, X. Chauffleur, P. Pons, C. Douziech, P. Favaro, Ph. Menini Intrinsic thermal behaviour of capacitive pressure sensors: mechanisms and minimization, Sensors and Actuators 85 (2000) 65–69.

R.Othmani, N .Benmoussa, B. Benyoucef. The thermal drift characteristics of piezoresistive pressure sensor, Physics procedia 21 (2011) 47-52 (SciVerse ScienceDirect).

Kanda, Y. A graphical representation of the piezoresistance coefficients in silicon, IEEE Trans. Electron Dev. 29, 64-70, 1982.

Abdolreza R Mohammadi, Chad P J Bennington and Mu Chiao, Development of a combined piezoresistive pressure and temperature sensor using a chemical protective coating for Kraft pulp digester process monitoring, J. Micromech. Microeng. 21 (2011) 015009.


Refbacks




Please send any question about this web site to info@praiseworthyprize.com
Copyright © 2005-2021 Praise Worthy Prize