Email this article 
Thermal Simulation Approach to the Cooling of a Power IGBT by Heat Pipe Systems
(*) Corresponding author
DOI's assignment:
the author of the article can submit here a request for assignment of a DOI number to this resource!
Cost of the service: euros 10,00 (for a DOI)
Abstract
In this work, we have developed a model in order to simulate the cooling of a power IGBT by heat pipe systems. The IGBT is modeled by RC thermal circuit approach on the basis on its thermal characteristics that are delivered by the manufacturer. The heat pipe is also modeled by RC thermal circuit. The thermal resistances and capacitances of the heat pipe model are determined both by experiments and theoretical calculations. The model aims to determine the junction temperature of the IGBT as well as the heat pipe temperatures in response to a periodic heat input power as a function of different parameters such as the cyclic ratio and the witching frequency. The simulations results indicate that for, a given switching frequency, the cyclic ratio affects the junction temperature which oscillates between a minimum value and a maximum one. Indeed, the maximum as well as the minimum junction temperatures increase with increasing cyclic ratio. For a given cyclic ratio, the junction temperature is also affected by the switching frequency. The maximum junction temperature decreases as the switching frequency increases, however, the minimum junction temperature increases with increasing switching frequency. In all cases, the junction temperature values remain less than the maximum temperature allowed for the safety operation of the IGBT.
Copyright © 2013 Praise Worthy Prize - All rights reserved.
Keywords
References
M.C. Zaghdoudi, C. Sarno, Investigation on the Effects of Body Force Environment on Flat Heat Pipes, J. Thermophysics and Heat Transfer, Vol. 15, N°4, 2001, p. 384-394.
M.C. Zaghdoudi, C. Tantolin, C. Godet, Heat Pipes for Efficient Cooling, Power Electronics Europe, N°1, 2003, pp. 15-21.
M.C. Zaghdoudi, C. Tantolin, C. Godet, Use of Heat Pipes Cooling Systems in Electronics Industry, Electronics Cooling, Vol. 10, N°4, 2004, pp. 12-20.
M.C. Zaghdoudi, C. Tantolin, C. Godet, Experimental and Theoretical Analysis on Enhanced Flat Miniature Heat Pipes with Axial Grooves, Journal of Thermophysics and Heat Transfer, Vol.18, N°4, 2004, pp. 330-347.
Mansouri, J., Maalej, S., Sassi, M.B.H., Zaghdoudi, M.C., Theoretical investigation on the thermal performance of two-phase heat spreaders including parallel microchannels, (2011) International Review on Modelling and Simulations (IREMOS), 4 (1), pp. 364-379.
Maalej, S., Mansouri, J., Zaghdoudi, M.C., Experimental and theoretical analysis on enhanced flat miniature heat pipes with axial capillary grooves and screen meshes, (2011) International Review of Mechanical Engineering (IREME), 5 (1), pp. 180-195.
Mansouri, J., Maalej, S., Sassi, M.B.H., Zaghdoudi, M.C., Experimental study on the thermal performance of enhanced flat miniature heat pipes, (2011) International Review of Mechanical Engineering (IREME), 5 (1), pp. 196-208.
Maalej, S., Mansouri, J., Sassi, M.B.H., Zaghdoudi, M.C., Theoretical and experimental study on the thermal performance of flat miniature heat pipes including rectangular grooves, (2011) International Review of Mechanical Engineering (IREME), 5 (2), pp. 266-278.
Zaghdoudi, M.C., Tantolin, C., Sarno, C., Experimental investigation on the use of Flat Mini Heat Pipes for avionics electronic modules cooling, (2011) International Review of Mechanical Engineering (IREME), 5 (4), pp. 770-783.
M.C. Zaghdoudi, C. Tantolin, C. Sarno, Acceleration and Vibration Effects on the Thermal Performance of a Two-phase Heat Spreader with Embedded Flat Mini Heat Pipe, (2011) International Review of Aerospace Engineering (IREASE), 4 (2), pp. 109-121.
M.C. Zaghdoudi, S. Maalej, J. Mansouri, M.B.H. Sassi, Flat Miniature Heat Pipes for Electronics Cooling: State of the Art, Experimental and Theoretical Analysis, International Journal of Engineering and Applied Sciences, Vol. 7, N° 3, 2011, pp. 166-189.
M.C. Zaghdoudi, S. Maalej, J. Mansouri, Theoretical and Experimental Analysis of Flows and Heat Transfer within Flat Miniature Heat Pipe Including Grooved Capillary Structures, Heat Transfer/ Book 4, ISBN 978-953-307-584-6, Chapter 5, September 2011, pp. 93-120.
Zaghdoudi, M.C., Tantolin, C., Sarno, C., Use of flat mini heat pipes for the thermal management of high dissipative electronic packages for avionic equipments, (2011) International Review of Mechanical Engineering (IREME), 5 (5), pp. 843-855.
Driss, A., Sassi, M.B.H., Maalej, S., Zaghdoudi, M.C., Transient thermal performance modeling and experimentation of heat pipes for high power electronics cooling, (2012) International Review on Modelling and Simulations (IREMOS), 5 (6), pp. 2473-2483.
A.R. Hefner, A Dynamic Electro-thermal Model for the IGBT, IEEE Transactions on Industrial Applications, Vol. 30, 1994, pp. 394-405.
A. Ammous, K. Ammous, H. Morel, B. Allard, D. Bergogne, F. Sellami, J.P. Chante, Electrothermal Modeling of IGBTs: Application to Short-circuit Conditions, IEEE Transactions on Power Electronics, Vol. 15, 2000, pp.778–790.
T. Kikunaga, T.Ohi, Analysis and Simulation Technologies for High Reliability Design of Power Modules, R&D Progress.Rep., Mitsubishi, 2003.
Z. Luo, H. Ahn, M.A. El Nokali, A Thermal Model for Insulated Gate Bipolar Transistor Module, IEEE Transactions on Power Electronics, Vol. 19, N° 4, 2004, pp. 902-907.
J. T. Hsu, L. Vu-Quoc, A Rational Formulation of Thermal Circuit Models for Electrothermal Simulation - Part I: Finite Element Method, IEEE Trans. Circuits Syst. I, Vol. 43, 1996, pp. 721–732.
A. Ammous, S. Ghedira, B. Allard, H. Morel, D. Renault, Choosing a Thermal Model for Electrothermal Simulation of Power Semiconductor Devices, IEEE Trans. Power Electron., Vol. 14, 1999, pp. 300–307.
G. L. Skibinski, W. A. Sethares, Thermal Parameter Estimation Using Recursive Identification, IEEE Trans. Power Electron., Vol. 6, 1991, pp. 228–239.
C. S. Yun, P. Malberti, M. Ciappa, W. Fichtner, Thermal Component Model for Electrothermal Analysis of IGBT Module Systems, IEEE Trans. Adv. Packag., Vol. 24, 2001, pp. 401–406.
Refbacks
- There are currently no refbacks.
Please send any question about this web site to info@praiseworthyprize.com
Copyright © 2005-2024 Praise Worthy Prize
