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Study of Ti Effect in Solder Type In-Ag-Ti on Bond Formation with Ceramic Materials by Use of Hybrid Soldering Process - Laser/Ultrasound

Igor Kostolný(1*), Tomáš Meluš(2), Roman Koleňák(3), Paulina Babincová(4), Michal Šimek(5)

(1) Slovak University of Technology in Bratislava, Faculty of Materials Science and Technology in Trnava, Jana Bottu No. 2781/25, 917 24 Trnava, Slovakia
(2) Slovak University of Technology in Bratislava, Faculty of Materials Science and Technology in Trnava, Jana Bottu No. 2781/25, 917 24 Trnava, Slovakia
(3) Slovak University of Technology in Bratislava, Faculty of Materials Science and Technology in Trnava, Jana Bottu No. 2781/25, 917 24 Trnava, Slovakia
(4) Slovak University of Technology in Bratislava, Faculty of Materials Science and Technology in Trnava, Jana Bottu No. 2781/25, 917 24 Trnava, Slovakia
(5) The First Welding Company Inc., Kopcianska No. 14, 851 01 Bratislava 5, Slovakia
(*) Corresponding author


DOI: https://doi.org/10.15866/ireme.v15i6.21048

Abstract


The work deals with the study of Ti effect in solder type In10Ag4Ti on bond formation with the ceramic materials Al2O3, SiC and ZrO2. The aim of this research was to study the wettability and interfacial reaction between solder and ceramic substrates using the progressive hybrid technology - laser/ultrasound. The goniometric method was used for the solder wettability measurement. The wettability of the solder on the ceramic substrates at the temperature of 700°C attained the values from 17 to 34°. Structural analysis of the boundary between the solder and substrate was carried out by scanning electron microscopy. The planar analysis of elements in bonds between the ceramic substrates and solder revealed the presence of a higher concentration of Ti on the boundaries. The wetting of oxidic ceramic materials was assured by bonding of titanium with oxides from the substrate’s surface by the formation of a thin layer of TiO. The SiC substrate was wetted by In10Ag4Ti solder owing to the reaction of titanium with carbon and/or silicon by the formation of reaction layers TiC and TiSi. The reaction between titanium from the solder during soldering and ultrasonic activation provided wetting and interactions between the solder and the ceramic substrates.
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Keywords


Active Solder; Microstructure; Soldering; Laser Beam; Ultrasonic; Ceramics

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References


Benda, Vítězslav & Grant, Duncan A. & Gowar, John, Power semiconductor devices: theory and applications, Wiley, Chichester ; New York, 1999. ISBN: 978-0-471-97644-8.

Hunter, Lloyd P. Handbook of Semiconductor Electronics: a Practical Manual Covering the Physics, Technology, and Circuit Applications of Transistors, Diodes, and Other Semiconductor Devices in Conventional and Integrated Circuits. McGraw-Hill, 1970. ISBN: 978-0070313057.

A. K. Sharma. Semiconductor Electronics; New Delhi, 2001. ISBN: 81-224-0802-8.

Y. Cao, T. Sato, M. Orshansky, D. Sylvester and C. Hu. New paradigm of predictive MOSFET and interconnect modeling for early circuit simulation, Proceedings of the IEEE 2000 Custom Integrated Circuits Conference (Cat. No.00CH37044), Orlando, FL, USA, 2000, pp. 201-204.

L. Shen et al., AlGaN/AlN/GaN high-power microwave HEMT, in IEEE Electron Device Letters, vol. 22, no. 10, pp. 457-459, Oct. 2001.
https://doi.org/10.1109/55.954910

U. Aydemir, İ. Taşçioğlu, Ş. Altindal, İ. Uslu, A detailed comparative study on the main electrical parameters of Au/n-Si and Au/PVA:Zn/n-Si Schottky barrier diodes, In Materials Science in Semiconductor Processing, Volume 16, Issue 6, 2013, pp. 1865-1872, ISSN 1369-8001.
https://doi.org/10.1016/j.mssp.2013.07.013

U. Wulf, J. Kučera, H. Richter, M. Wiatr, J. Höntschel. Characterization of nanotransistors in a semiempirical model, In Thin Solid Films, Volume 613, 2016, Pages 6-10, ISSN 0040-6090.
https://doi.org/10.1016/j.tsf.2015.09.041

T. Stockmeier, P. Beckedahl, C. Goebl, and T. Malzer, SKiN: Double side sintering technology for new packages, in 2011 IEEE 23rd International Symposium on Power Semiconductor Devices and ICs, IEEE, 2011, pp. 324-327.
https://doi.org/10.1109/ISPSD.2011.5890856

C. Zweben, Adv. Packag., 15 (2) (2006), pp. 1-5.

R. Khazaka, L. Mendizabal, D. Henry, and R. Hanna, Survey of high-temperature reliability of power electronics packaging components, IEEE Transactions on Power Electronics, vol. 30, no. 5, pp. 2456-2464, 2015.
https://doi.org/10.1109/TPEL.2014.2357836

L. Coppola, D. Huff, F. Wang, R. Burgos, and D. Boroyevich, Survey on high-temperature packaging materials for SiC-based power electronics modules, in 2007 IEEE Power Electronics Specialists Conference, IEEE, 2007, pp. 2234-2240.
https://doi.org/10.1109/PESC.2007.4342356

W. Brokaw, J. Elmes, B. Grummel, Z. J. Shen, and T. X. Wu, Silicon carbide high-temperature packaging module fabrication, in 2013 IEEE Workshop onWide Bandgap Power Devices and Applications (WiPDA), IEEE, 2013, pp. 178-181.
https://doi.org/10.1109/WiPDA.2013.6695591

W. W. Sheng and R. P. Colino, Power electronic modules: design and manufacture. CRC press, 2004.
https://doi.org/10.1201/9780203507308

XIAN, A.P., Wetting of Si-Al-O-N ceramic by Sn-5 at. % Ti-X ternary active solder. In Materials Science and Engineering B25, 1994, pp. 39-46.
https://doi.org/10.1016/0921-5107(94)90199-6

Un-Byoung Kang and Young-Ho Kim, A new COG technique using low temperature solder bumps for LCD driver IC packaging applications, in IEEE Transactions on Components and Packaging Technologies, vol. 27, no. 2, pp. 253-258, June 2004.
https://doi.org/10.1109/TCAPT.2004.828585

Z. Mei, H. Holder, and H. V. Plas, Hewlett-Packard J. 48, 91 (1996).

Min-Suk Suh, Chan-Jin Park, Hyuk-Sang Kwon, Effects of plating parameters on alloy composition and microstructure of Sn-Bi electrodeposits from methane sulphonate bath, in Surface and Coatings Technology, 200 (11), 2006, pp. 3527-3532.
https://doi.org/10.1016/j.surfcoat.2004.08.162

Chang, S.Y., Hung, Y.T. & Chuang, T.H. Joining alumina to inconel 600 and UMCo-50 superalloys using an Sn10Ag4Ti active filler metal. J. of Materi Eng and Perform 12, 123-127 (2003).
https://doi.org/10.1361/105994903770343240

S. Kang, J.H. Selverian.. Interactions between Ti and alumina-based ceramics. J Mater Sci, 27 (1992), pp. 4536-4544.
https://doi.org/10.1007/BF00541591

Q. Gu, Y. X. Wang, Y.D. Cui, X. Chen, K. Tao. Interfacial reaction of Ti and sapphire. Wuli Xuebao/Acta Phys Sinica, 45 (5) (1996).
https://doi.org/10.7498/aps.45.832

J. J. Stephens, F.M. Hosking, T.J. Headley, P.F. Hlava, F.G. Yost. Reaction layers and mechanisms for a Ti-activated braze on sapphire. Metall Mater Trans A, Phys Metall Mater Sci, 334 (12) (2003), pp. 2963-2972.
https://doi.org/10.1007/s11661-003-0195-9

A. Xian. Joining of sialon ceramics by Sn-5 at% Ti based ternary active solders. J Mater Sci, 32 (1997), pp. 6387-6393.
https://doi.org/10.1023/A:1018674102837

Rashidi, Roxana a Homam Naffakh-Moosavy. Metallurgical, Physical, Mechanical and Oxidation Behavior of Lead-Free Chromium Dissolved Sn-Cu-Bi Solders. Journal of Materials Research and Technology [online]. 2021, 31.6.2021 [cit. 2021-6-2]. ISSN 2238-7854. Available from: https://www.sciencedirect.com/science/article/pii/S2238785421004956

Lanin, V. L. Ultrasonic soldering in electronics. Ultrason Sonochem, 8 (2001), pp. 379-385.
https://doi.org/10.1016/S1350-4177(01)00065-7

Koleňák, R., Solderability of Ceramic and Metal Materials with Utilization of Active Solders and Power Ultrasound, (2016) International Review of Mechanical Engineering (IREME), 10 (6), pp. 405-408.
https://doi.org/10.15866/ireme.v10i6.9516

Kolenak, R.; Kostolny, I.; Drapala, J.; Zackova, P.; Kuruc, M. Direct Ultrasonic Soldering of AlN Ceramics with Copper Substrate Using Zn-Al-Mg Solder. Metals 2020, 10, 160.
https://doi.org/10.3390/met10020160

Daniela Šuryová, Igor Kostolný, Roman Koleňák. Fluxless ultrasonic soldering of SiC ceramics and Cu by Bi-Ag-Ti based solder. AIMS Materials Science, 2020, 7(1): 24-32.
https://doi.org/10.3934/matersci.2020.1.24

Zhengwei Li, Zhiwu Xu, Zhongwei Ma, Zirong Xu, Xuesong Liu, Jiuchun Yan. Dependence of the microstructure and properties of joints on acoustic intensity during the ultrasonic soldering of 7075 Al alloys, In Journal of Manufacturing Processes. Vol. 64, 2021. Pp. 518-529.
https://doi.org/10.1016/j.jmapro.2021.02.020

Zhiwu Xu, Zhengwei Li, Yushi Qi, Jiuchun Yan. Soldering porous ceramics through ultrasonic-induced capillary action and cavitation. In Ceramics International. Vol. 45, Iss. 7, 2019. Pp. 9293-9296.
https://doi.org/10.1016/j.ceramint.2019.01.171

Zhiwu Xu, Zhengwei Li, Jiaqi Li, Zhipeng Ma, Jiuchun Yan. Control Al/Mg intermetallic compound formation during ultrasonic-assisted soldering Mg to Al. In Ultrasonics Sonochemistry. Vol 46, 2018. Pp. 79-88.
https://doi.org/10.1016/j.ultsonch.2018.04.010

Xiong Yi, Ruhua Zhang, Xiaowu Hu. Study on the microstructure and mechanical property of Cu-foam modified Sn3.0Ag0.5Cu solder joints by ultrasonic-assisted soldering. In Journal of Manufacturing Processes. Vol. 64, 2021. Pp. 508-517.
https://doi.org/10.1016/j.jmapro.2021.02.003

Drevo, EP. Nimmo, KL. In search of new unleaded electronic solder. Elektron. Mater. 23 (8) (1994), str. 709 - 713
https://doi.org/10.1007/BF02651363

R. Koleňák, P. Šebo, M. Provazník, M. Koleňáková, K. Ulrich, Shear strength and wettability of active Sn3.5Ag4Ti(Ce,Ga) solder on Al2O3 ceramics, Materials & Design, Volume 32, Issue 7, 2011, Pages 3997-4003, ISSN 0261-3069.
https://doi.org/10.1016/j.matdes.2011.03.022


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