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Study of Ti Effect in Solder Type In-Ag-Ti on Bond Formation with Ceramic Materials by Use of Hybrid Soldering Process - Laser/Ultrasound

Igor Kostolný(1*), Tomáš Meluš(2), Roman Koleňák(3), Paulina Babincová(4), Michal Šimek(5)

(1) Slovak University of Technology in Bratislava, Faculty of Materials Science and Technology in Trnava, Jana Bottu No. 2781/25, 917 24 Trnava, Slovakia
(2) Slovak University of Technology in Bratislava, Faculty of Materials Science and Technology in Trnava, Jana Bottu No. 2781/25, 917 24 Trnava, Slovakia
(3) Slovak University of Technology in Bratislava, Faculty of Materials Science and Technology in Trnava, Jana Bottu No. 2781/25, 917 24 Trnava, Slovakia
(4) Slovak University of Technology in Bratislava, Faculty of Materials Science and Technology in Trnava, Jana Bottu No. 2781/25, 917 24 Trnava, Slovakia
(5) The First Welding Company Inc., Kopcianska No. 14, 851 01 Bratislava 5, Slovakia
(*) Corresponding author



The work deals with the study of Ti effect in solder type In10Ag4Ti on bond formation with the ceramic materials Al2O3, SiC and ZrO2. The aim of this research was to study the wettability and interfacial reaction between solder and ceramic substrates using the progressive hybrid technology - laser/ultrasound. The goniometric method was used for the solder wettability measurement. The wettability of the solder on the ceramic substrates at the temperature of 700°C attained the values from 17 to 34°. Structural analysis of the boundary between the solder and substrate was carried out by scanning electron microscopy. The planar analysis of elements in bonds between the ceramic substrates and solder revealed the presence of a higher concentration of Ti on the boundaries. The wetting of oxidic ceramic materials was assured by bonding of titanium with oxides from the substrate’s surface by the formation of a thin layer of TiO. The SiC substrate was wetted by In10Ag4Ti solder owing to the reaction of titanium with carbon and/or silicon by the formation of reaction layers TiC and TiSi. The reaction between titanium from the solder during soldering and ultrasonic activation provided wetting and interactions between the solder and the ceramic substrates.
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Active Solder; Microstructure; Soldering; Laser Beam; Ultrasonic; Ceramics

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