Solderability of Ceramic and Metal Materials with Utilization of Active Solders and Power Ultrasound

Roman Koleňák

doi:10.15866/ireme.v10i6.9516

Solderability of Ceramic and Metal Materials with Utilization of Active Solders and Power Ultrasound

Roman Koleňák^(1*)

^(*) Corresponding author

Authors' affiliations

DOI: https://doi.org/10.15866/ireme.v10i6.9516

Abstract

This project studies soldering a substrate of Al2O3 ceramics and Si with a Cu substrate using Sn-Ag-Ti solder. Soldering was done by a fluxless method in air activated by power ultrasound. It was found that Ti during the ultrasonic soldering process is distributed to the interface with Al2O3 and Si substrate, thus enhancing bond formation. The bond with ceramic and Si substrate has a diffusion character forming a new contact interlayer. The shear strength of joints with Al2O3 ceramics is 33 MPa and with Si substrate 23 MPa.
Copyright © 2016 Praise Worthy Prize - All rights reserved.

Keywords

Ceramic; Metal; Ultrasound; Solders; Joints

Full Text:

PDF

References

Suganuma, K. Recent Advances in Joining Technology of Ceramics to Metals. In ISIJ International, Vol. 30, No. 12, 1990, pp. 1046-1058.
http://dx.doi.org/10.2355/isijinternational.30.1046

Xian, A.P., Wetting of Si-Al-O-N ceramic by Sn-5at.%Ti-X ternary active solder. In Materials Science and Engineering B25, 1994, pp. 39-46.
http://dx.doi.org/10.1016/0921-5107(94)90199-6

Koleňák, R., Prach, M. Research of Joining Graphite by use of Active Solder. In Advanced Materials Research, Vol. 875-877, 2014, pp. 1270-1274.
http://dx.doi.org/10.4028/www.scientific.net/amr.875-877.1270

Wang, W.L., Tsai, Y.C. Microstructural characterization and mechanical property of active soldering anodized 6061 Al alloy using Sn–3.5Ag–xTi active solders. In Materials Characterization, Vol. 68, 2012, pp. 42-48.
http://dx.doi.org/10.1016/j.matchar.2012.03.007

Tsao, L.C. Interfacial structure and fracture behavior of 6061 Al and MAO-6061 Al direct active soldered with Sn-Ag-Ti active solder. In Materials and Design, Vol. 56, 2014, pp. 318-324.
http://dx.doi.org/10.1016/j.matdes.2013.11.021

Zhang, L., Xue, S.B., Gao, L.L., et al.: Effects of rare earths on properties and microstructures of lead-free solder alloys. In Journal of Materials Science: Materials in Electronics, Vol. 20, Is. 8, 2009, pp. 685- 670.
http://dx.doi.org/10.1007/s10854-009-9895-2

Wu, C.M.L., Yu, D.Q., et al. Properties of lead free solder alloys with rare earth element additions. In Materials Science and Engineering, Vol 44, Is. 1, 2004, pp. 1-44.
http://dx.doi.org/10.1016/j.mser.2004.01.001

Dudek M.A., Sidhu R.S., Chawla N., Renavikar M.: Microstructure and Mechanical Behavior of Novel Rare Earth-Containing Pb-Free Solders. In Journal of Electronic Materials, Vol. 35, No. 12, 2006, p. 2088-2097.
http://dx.doi.org/10.1007/s11664-006-0318-3

Chang, S.Y., Chuang, T.H., Yang, C.L. Low temperature bonding of alumina/alumina and alumina/copper in air using an Sn3.5Ag4Ti(Ce,Ga) filler. In Journal of Electronic Materials, Vol. 36, Is. 9, 2007, pp. 1193-1198.
http://dx.doi.org/10.1007/s11664-007-0190-9

Chang, S.Y., Chuang, T.H., Tsao, L.C., Yang, C.L., Yang, Z.S. Active soldering of ZnS-SiO2 sputtering targets to copper backing plates using an Sn3.5Ag4Ti(Ce,Ga) filler metal. In Journal of Materials Processing Technology, Vol. 202, 2008, pp. 22-26.
http://dx.doi.org/10.1016/j.jmatprotec.2007.08.045

Chang, S.Y., Tsao, L.C., Chiang, M.J., et al. Active Soldering if Indium Tin Oxide (ITO) With Cu in Air Using an Sn3.5Ag4Ti(Ce,Ga) Filler. In Journal of Materials Engineering and Performance, Vol. 12 (4), 2003, pp. 383-389.
http://dx.doi.org/10.1361/105994903770342890

Koleňák, R., Šebo, P., Provazník, M., Koleňáková, M., Ulrich, K. Shear strength and wettability of active Sn3.5Ag4Ti(Ce,Ga) solder on Al2O3 ceramics. In Materials and Design, Vol. 32, 2011, pp. 3997-4003.
http://dx.doi.org/10.1016/j.matdes.2011.03.022

Refbacks

There are currently no refbacks.

Username
Password
Remember me