Effect of Debris Flushing in Micro-WEDM

Preetam Hemant Selmokar; Akib Attar; Sujit Suresh Pardeshi

doi:10.15866/ireme.v10i3.8485

Effect of Debris Flushing in Micro-WEDM

Preetam Hemant Selmokar⁽¹⁾, Akib Attar⁽²⁾, Sujit Suresh Pardeshi^(3*)

^(*) Corresponding author

Authors' affiliations

DOI: https://doi.org/10.15866/ireme.v10i3.8485

Abstract

Micro manufacturing involves the manufacturing of products with feature size in the order of micrometers with specific applications such as micro-scale fuel cells, micro-scale pumps, micro-molds, subminiature actuators, miniaturized bearings, medical devices and biomedical implants etc. Miniaturized components normally require processing of materials having distinct/specialized characteristics with high accuracy. These materials are difficult to machine conventionally and they can be easily machined with the desired accuracy using micro EDM/WEDM (wherein no cutting forces are involved). One major drawback which restricts the wide commercial application of micro WEDM is the very low material removal rate (MRR) which makes it economically non-viable. Low MRR is attributed towards the ineffective evacuation of eroded particles from the working area, which results into re-deposition. An attempt to improve flushing of debris using air and gas in addition to liquid dielectric is reported in the current work. Improvements in debris removal strategies have yielded a promising improvement in MRR.
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Keywords

Debris; Gas Assisted Micro WEDM; Kerf Width; MicroWEDM; MRR

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