Investigation on Device Temperature in Power Electronics Switches Used in Open-end Winding Induction Motor Drive for Alternate Fixed-bias Inverter Scheme


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Abstract


This paper investigates the rise in junction temperature in power semiconductor devices that occur due to the alternate Fixed-bias inverter switching scheme for an open-end winding induction motor drive. The PWM scheme considered here uses only instantaneous phase reference voltages. The inverter losses are estimated for this drive system with this PWM strategy using an existing thermal model.  The motor current is computed using d-q model of an open-end winding induction motor and the simulation study was performed using MATLAB/Simulink.
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Keywords


Open-End Winding; Space Vector Modulation; Thermal Evaluation; Junction Temperature

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References


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